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Qualcomm Robotics RB3 Platform (SDA845)

高通机器人开发平台

采用搭载异构计算架构高通SDA845处理器的DragonBoard 845C作为主板的机器人开发套件。

它集成了高达 2.8GHz/八核的 Qualcomm Kryo CPU、Qualcomm Adreno 630 GPU 和 Qualcomm Hexagon 685 DSP。

它支持 Linux 和 ROS,还支持高通神经处理 SDK、高通计算机视觉套件、高通 Hexagon DSP SDK 和用于设备端 AI 的 AWS RoboMaker。

它具有高能效,适用于从大型工业机器人到小型电池供电机器人的各种机器人开发。

产品负责人

姓名:刘工

电话:13381615204(同微信)

邮箱:sales@yixinkeyan.com

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产品型号

产品名称 型号 货期 单价
Qualcomm Robotics RB3 Development Basic Kit 开发基础套件 2-4周 学术折扣价

目前产品均为在售中,如果您对产品的规格参数、报价、货期等信息有任何问题,请随时和我们或者产品负责人联系,我们将在收到您的询问信息后第一时间给您回复。

产品描述

套件内容:

  • Robotics DragonBoard™ 845c development board featuring Qualcomm® SDA/SDM845 processor and compliant with the 96Boards open hardware specification

  • Qualcomm Robotics navigation mezzanine featuring time-of-flight, tracking camera, active stereo camera and main camera, which is compliant with 96Boards open hardware specification

  • Sensor support including the industry’s best performing ICM-42688 6-Axis High Performance Motion Sensor, ICS-41351 Top Port Digital Microphone, and ICP-10101 Barometric Pressure Sensor from TDK InvenSense

  • Qualcomm Robotics cellular mezzanine (可选)

  • Multi-Mic support

  • Power supply

规格参数:

SoC : Qualcomm SDA845

CPU : SDA845 8x Kryo 385 CPU, up to 2.8 GHz

GPU : Qualcomm Adreno 630 GPU with support for Open GL ES 3.2 and Open CL 2.0

DSP : Qualcomm Hexagon 685 DSP with 3rd Gen Vector Extensions

ISP : Qualcomm Spectra 280 Image Signal Processor with new architecture for 14-bit image signal processing

RAM : 4GB LPDDR4x SDRAM @ 1866 MHz

Memory : LPDDR4x, 4x16 bit; up to 1866MHz, 4GB RAM

Storage : 64GB UFS 2.1 on-board storage and 1 x MicroSD card slot

Ethernet : 1x GbE Ethernet

Wireless :
- Wi-Fi integrated 802.11ac 2x2 with MU-MIMO; Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS).
- Qualcomm TrueWireless Bluetooth 5.0

Location : GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS

USB :
- 1 x USB 2.0 Micro B (Debug only)
- 1 x USB 3.0 Type C (OTG mode)
- 2x USB 3.0 Type A (Host mode only)

Display :
- Two 4-lane DSI, D-PHY 1.2 or C-PHY 1.0; VESA DSC 1.1
- 1 x HDMI 1.4 (Type A - full) connector

Video : Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut; H.264 (AVC), H.265 (HEVC) and VP9 support; Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps

Audio : MP3; aacPlus, eAAC; WMA 9/Pro

Camera : Single HFR 16 MPix camera at 60fps ZSL, Dual 16 MPix cameras at 30fps ZSL, Single 32 MPix camera at 30fps ZSL

Sensor : ICM-42688 6-Axis High Performance Motion Sensor, ICS-41351 Top Port Digital Microphone, and ICP-10101 Barometric Pressure Sensor from TDK InvenSense.
Expansion Interfaces : 2 x 60 pin High-Speed connectors , 2 x 40 pin Low-Speed connectors, 1 x 20 pin Low-Speed connector

LED : 7 x LED indicators

Button : Power ,Volume Up/Down,Force Usb Boot, DIP Switch

Power Source : 12V@2.5A adapter with a DC plug

OS Support : LE

Size : 85mm by 54 mm

产品图片:

  
  

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